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Asia Pacific MEMS Commercialization Forum
24-25 June, 2004
Hsinchu, Taiwan

Asia Pacific MEMS Commercialization Forum to Address Challenges and Opportunities in the Worldwide Market

Asian Pacific and USA microsystems industry experts will address the challenges and opportunities of transforming technology research breakthroughs into commercial reality during the two day Asia Pacific MEMS Commercialization Forum, to be held in Hsinchu, Taiwan on 24 and 25 June 2004. The event is jointly organized by new MANCEF member Industrial Technology Research Institute (ITRI), the Micro and Nanotechnology Commercialization Education Foundation (MANCEF), and the Northern America Taiwanese Engineers' Association (NATEA).

Over 150 delegates from U.S., Taiwan and other Asia Pacific locations are expected to converge on the ITRI conference center near the world famous Hsinchu Science Park. Attendees can expect business-oriented presentations and panel discussions, as well as many networking opportunities, all organized to help industry participants to better exploit market opportunities and overcome the barriers to successful commercialization.

The theme of the forum will be commercialization of MEMS technology, both from business development and product development perspective. Asia Pacific is currently a leader in MEMS commercialization by leveraging the strength and breadth of its technology infrastructure and strong track record of technology commercialization from semiconductors to LCD monitors. The forum promises to cover the latest business opportunities in worldwide MEMS applications, key enabling technologies and equipment for MEMS product development and manufacture.

The workshop Co-Chairs are Dr. Johnsee Lee (ITRI) and Jane Niall (MANCEF VP of Asia Pacific, jniall@mancef.org). Workshop organizers are T.S. Lin (ITRI), Tom Chang (Store Card / NATEA) and Roger Grace (Roger Grace Associates).

More information about the program and attendee registration for the event

Confirmed Speakers

The Asia Pacific MEMS Commercialization Forum has arranged for a high-impact roster of industry leaders, including:

  • Cheng-I Wen, Ph.D. – Chairman of ITRI and Chairman of Nanotechnology and Micro system Association, Taiwan
  • Kees Eijkel, Ph.D. – President, MANCEF and Technical Commercial Director, MESA+ Institute (Netherlands)
  • Roger Grace – Co-founder and Past President of MANCEF and Co-Chairman of COMS2004 and President of Roger Grace Associates (USA)
  • Joseph R. Mallon Jr. - Founding President of Nova Sensor (USA) and President, memvent (USA)
  • Kurt Petersen, Ph.D., President, Cepheid (USA)
  • Dan Hyman, Ph.D., CEO, Xcom Wireless (USA)
  • Sheau Chen, Ph.D., CEO, WaveSplitter (USA) and President of NATEA
  • C.K. Lee, Ph.D., Director, NDT&M Lab. National Taiwan University (Taiwan)
  • George Yokoi, Senior Manager, MEMS-business development, Olympus (Japan)
  • M.S. Lin, Ph.D., President and CEO, Asia Pacific Microsystems, Inc. (Taiwan)
  • S. Sche, Ph.D., President and CEO, NeoStones MicroFabrication, Inc. (Taiwan)
  • Bevan Wu, Ph.D., President, BW & Associates and Consultant to ITRI USA (USA)
  • Eaden Saw, Ph.D., Vice President, Microdevice and Packaging, Inc. (USA)
  • Tom Chang, Director of Heads and Media, StorCard (USA)
  • Joe Brown, Marketing Manager, Suss Microtec (USA)
  • Andrew Chambers, Technology Director, STS (UK)
  • Jean-Marc Gruffat, Vice President, Alcatel (France)
  • Christian Schaefer, Ph.D., Vice President, EVGroup (Austria)

Program Highlights

The agenda covers a wide variety of topics addressing MEMS business, applications and product development. These include:

  • Barriers to the Successful Commercialization of MEMS
  • US-Asia Pacific Collaboration Business Model for Micro Device Development
  • BioMEMS
  • RF MEMS
  • MEMS for High-Volume Automobile Industry
  • MEMS in Data Storage
  • Taiwan's MEMS Infrastructure
  • Successful MEMS Start-Ups
  • From Semiconductor to MEMS
  • MEMS Packaging and Integration

in addition to a number of presentations addressing MEMS manufacturing issues and related capital equipment tools.

Many opportunities for networking will be provided during the numerous breaks and cocktail reception during the two-day event.

Sponsorship

Sponsors of the Forum include MANCEF's Charter Members EVGroup and Surface Technology Systems, as well as MANCEF's new Corporate Members Alcatel and Suss Microtec. Representatives from these organizations will make technology presentations and will be available at their exhibit booths during the event to discuss the technology and applications of their products.

A limited number of exhibitor/sponsor opportunities currently exist at a cost of $1500 US. Please contact the Forum Exhibits Organizer, Mr. Joe Brown, Suss Microtec at jbrown@mancef.org for more information.

Location

The conference will also shine an international spotlight on Hsinchu, Taiwan as the home to an emerging nano and microsystems cluster that includes the ITRI, two of the best universities in Taiwan and Hsinchu Science Park where MEMS foundries and design companies are involved in micro-and nano-based enterprises. Hsinchu is located 50 miles South of Taipei, the capital city of Taiwan and is near many beautiful resorts, golf courses and scenery spots.

More information about the program and attendee registration for the event here.


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